CMP, Often called thermal oxidation sprucing, utilizes MP along with chemicals to enhance the MRR and enhance surface quality [twenty]. Figure 2 illustrates the schematic of a normal CMP process [21]. The SiC wafer, that's mounted about the carrier, and the sharpening pad transfer relative to one another underneath a https://www.quora.com/profile/Trevor-Flatcher-2/The-Key-Role-of-Silicon-Carbide-in-Electric-Vehicle-Batteries-Electric-vehicles-EVs-have-emerged-as-a-pivotal-solutio